https://dailydigest.aabot.us/zh/tags/%E5%8D%8A%E5%AF%BC%E4%BD%93%E5%B0%81%E8%A3%85/ Recent content in 半导体封装 on Deep Research Hugo zh-CN Sun, 26 Apr 2026 04:00:00 +0000 https://dailydigest.aabot.us/zh/posts/2026-04-26-glass-substrates-replace-organic-materials-in-advanced-semiconductor-packaging-enabling-10x-wiring-density-for-ai-processors/ Sun, 26 Apr 2026 04:00:00 +0000 https://dailydigest.aabot.us/zh/posts/2026-04-26-glass-substrates-replace-organic-materials-in-advanced-semiconductor-packaging-enabling-10x-wiring-density-for-ai-processors/ 玻璃基板正在取代先进半导体封装中的有机材料，实现10倍更高的互连密度，并解决威胁万亿晶体管AI处理器的翘曲危机。英特尔的玻璃核心技术将于2027年末在数据中心产品中推出，提供亚2微米通孔能力和高达200°C的热稳定性——这使得下一代AI加速器所需的大规模多芯粒架构成为可能。