The Glass Revolution: How Intel's 10x Interconnect Breakthrough Is Rebuilding AI Chip Architecture from the Ground Up
Glass substrates are replacing organic materials in advanced semiconductor packaging, enabling 10x higher interconnect density and solving the warpage crisis that threatens trillion-transistor AI processors. Intel’s glass core technology, launching in late-2027 data center products, delivers sub-2-micron via capabilities and thermal stability up to 200°C—making possible the massive multi-chiplet architectures needed for next-generation AI accelerators.