2nm

TSMC leads mass production of 2nm nodes with backside power delivery networks (BSPDN) in 2026, while Intel and Samsung develop competing architectures. This breakthrough technology places power rails on the wafer’s backside, reducing IR drop by up to 30% and enabling higher transistor densities for next-generation AI and HPC chips.

Major foundries are implementing backside power delivery networks to overcome IR drop limitations at advanced nodes. TSMC’s N2 (2025), Intel’s 18A PowerVia (2024), and Samsung’s SF2Z processes represent a fundamental shift from shared front-side routing to decoupled power architectures, addressing power delivery impedance that scales as ρL/A in increasingly constrained geometries.