Major foundries are implementing backside power delivery networks to overcome IR drop limitations at advanced nodes. TSMC’s N2 (2025), Intel’s 18A PowerVia (2024), and Samsung’s SF2Z processes represent a fundamental shift from shared front-side routing to decoupled power architectures, addressing power delivery impedance that scales as ρL/A in increasingly constrained geometries.

Roman concrete gets stronger in seawater through Al-tobermorite crystallization. Inca walls survive magnitude-8 earthquakes by rocking 2-3° at dry joints, dissipating seismic energy through friction. Sri Lankan engineers invented pressure-reduction valve towers in the 3rd century BCE. Three case studies in constraint-driven design that are generating real insights for modern materials science — and connecting to computational materials discovery.

As silicon transistors approach fundamental physical limits, transition metal dichalcogenides — atomically thin semiconductors like MoS₂ and WSe₂ — are emerging as the most credible path forward. Here’s where the science actually stands.

AI compute is outpacing memory bandwidth by 3× per generation. HBM4’s 2 TB/s promise is a marvel of engineering — and it still isn’t enough.

Intel’s 1.15-billion-neuron Hala Point and IBM’s NorthPole are rewriting the efficiency playbook — but neuromorphic computing still needs its killer app.